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Tool Order: Okamoto to supply backgrinder system for SEMATECH‚??s 3D TSV project

18 September 2009 | By Mark Osborne | News > Wafer Processing

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Okamoto is to supply its GDM300 Backgrinder for processing 3D Through Silicon Via (TSV) technologies at SEMATECH’s 3D R&D Center at the College of Nanoscale Science and Engineering’s (CNSE). The system is designed for thin wafer applications such as TSV, bonded wafers, SOI, and MEMS.

“The addition of Okamoto’s wafer-thinning tool will support the advanced work being done through SEMATECH’s 3D program, as well as the state-of-the-art capabilities at CNSE’s Albany NanoTech, which are enhancing the industry’s efforts to manufacture increasingly complex nanoscale devices,” commented Richard Brilla, CNSE’s Vice President for Strategy, Alliances and Consortia.

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