Oerlikon Systems has signed an order for the delivery of several of its Clusterline 300II tools to the world’s largest semiconductor foundry, TSMC. The deal, the value of which was undisclosed, overrides orders for the same tool received from key semiconductor manufacturers in South Korea and Taiwan. The Clusterline 300II is a cluster tool specifically designed for advanced packaging and backside metallization for wafer sizes up to 300mm.
“The ever increasing interest in our Clusterline products has been expected but the large multiple orders have exceeded our expectations,” said Andreas Dill, Head of Oerlikon Systems. “Our efforts focus on optimizing innovative solutions for under bump metallization (UBM), redistribution layers, backside metallization and ultra thin wafer processing.”
The success and popularity of the tool is, according to the company, due in large part to the involvement of marketing, sales and service company DKSH Taiwan. Oerlikon Systems brought the company on board in May 2009; since then, the DKSH Taiwan team has been working closely with the Oerlikon product managers and development teams to aid in succeeding in the Taiwan market.