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Tool Order News Focus

04 February 2005 | By Syanne Olson | News > Wafer Processing

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Advanced Micro Devices has placed a major order with Applied Materials for 300mm equipment to manufacture its future advanced 65nm-generation 64-bit microprocessors. The orders cover a broad range of process technologies, including Applied's most advanced etch systems, as well as a comprehensive suite of metrology and inspection tools. The systems began shipping in late 2004. AMD selected several types of etchers, including the company's latest Applied Centura Enabler and Producer Dielectric Etch systems for etching advanced copper/low k interconnects.AMD also chose the new high-throughput, high-resolution Applied VeritySEM Metrology CD-SEM, the Applied SEMVision FIB (focused ion beam) defect analysis system and the ComPlus wafer inspection system. Applied Materials was selected as AMD's exclusive supplier of high current, low energy implant technology with its purchase of Applied Quantum® X Implant systems.

Other technologies chosen for building 65nm transistors included Applied's gate stack and RTP (rapid thermal processing) systems. For dielectric CVD (chemical vapor deposition) applications, AMD purchased a large number of Applied Producer systems to deposit a broad range of PECVD and low k films. A number of Applied Endura2 PVD (physical vapor deposition) and Applied Reflexion CMP (chemical mechanical polishing) systems were ordered for both transistor and copper interconnect applications.
Advanced Micro Devices has also selected Axcelis Technologies, low energy, single-wafer implant technologyfor Fab 36 in Dresden, Germany. AMD will use Axcelis' new single-wafer technology for well and channel and high-tilt HALO implant applications in the 90nm to 45nm technology nodes. Axcelis plans to formally unveil the new single-wafer platform in early 2005

SMIC has received a single wafer VIISta 3000HP high-energy ion implanter from Varian Semiconductor Equipment Associates for its 300mm (Fab4) in Beijing, China. The VIISta 3000 series ion implanters have now been selected in logic, DRAM and foundry operations in Asia, Europe, and the United States, according to the equipment manufacturer.

Major DRAM Manufacturer in Asia has placed an order for a StrataGem300 atomic layer deposition (ALD) system from Genus, Inc. The order is for the StrataGem300 multi-chamber 300mm ALD system will be used in a large-scale DRAM production environment.

A major Japanese semiconductor manufacturer has selected two wafer cleaning DV-34BF tools from the SEZ Group for evaluation in high-volume manufacturing environments. The chipmaker, a long-time SEZ customer, is expected to purchase multiple Da Vinci tools over the next two years based on the results of its evaluation process, which will commence when the tools are delivered in the first quarter of 2005. Da Vinci tools will represent more than one third of its total sales in the coming year with Japan accounting for 20 percent of our total sales.

Innotera, has placed a multi-million dollar follow-on orders for Mattson Technologies strip and RTP tools. Innotera chose multiple Helios RTP systems and the Aspen III ICPHT system for 100% of its strip requirements for phase II of its 300mm fab expansion. The systems have begun shipping to the customer's fab in Taiwan, where they will support advanced 11nm and below memory device production.

A top ten semiconductor manufacturer has ordered multiple AXi- 935, advanced macro defect inspection systems from August Technology. These are the first orders for the new tool. The AXi-935 is the latest addition to the AXi Series of automated wafer inspection solutions for applications in front-end wafer fabs and is specifically designed to improve throughputs at higher magnification levels. The systems are scheduled to begin shipping in the first quarter of 2005.

Samsung has placed repeat orders for Rudolph Technologies' MetaPULSE Metrology tools. The Company has delivered tools throughout 2004 and is expected to complete shipments against these orders in the first quarter of 2005. The MetaPULSE systems are being used to provide high-volume production monitoring for aluminum metallization layers at the 110 and 90nm technology nodes on 200mm and 300mm wafers. The tools are also being used to develop advanced 85 and 65nm processes.

Leading IC manufacturer based in Taiwan has placed a repeat order with FSI International for its 300mm ZETA® Spray Cleaning System. The tool will be used for front-end-of-line (FEOL) surface preparation at the 90nm technology node. The repeat order from the Taiwanese customer is the result of the ZETA System's 65nm joint development program with the result that significantly less chemical consumption was demonstrated over competing single wafer wet cleaning systems, according to the company.

Infineon has placed orders with Mattson Technology for its Aspen III ICPHT strip and Helios RTP systems. Following head-to-head competitive evaluations, Mattson's advanced strip and RTP tools were selected for its first 300mm fab in Richmond, Virginia. The systems, the first of which has begun shipment, will be used for volume-production of the chipmaker's most advanced memory products, including chips used in personal computers, computer servers and other electronic devices.

Two major semiconductor manufacturers will use FEI's CLM-3D metrology system in the development and implementation of nextgeneration nanometer lithography, etch, deposition and CMP manufacturing processes. The customers are leading designers and manufacturers of memory and logic chips. FEI's CLM-3D 300mm DualBeam(TM) is an in-line, in-fab, full-wafer system for automated 3D metrology and analysis of latest generation semiconductor devices.

Samsung has selected SEZ's multi-chamber spin-processor technology for back-end-of-line (BEOL) polymer removal on dynamic random-access memory (DRAM) devices. The SEZ tool has been shipped and is currently installed and running. This customer is also the first Korean chipmaker to deploy dilute sulfuric peroxide, plus (DSP+) for 300mm memory manufacturing. SEZ is pioneering the use of its 300mm systems with DSP+, an emerging polymer-removal chemical compound with the potential to replace conventional strippers in high-volume manufacturing due to its relatively low cost of ownership (CoO) and its enhanced electrical characteristics, according to SEZ.

Major Japanese logic chipmaker has selected the Aspen III ICPHT strip system from Mattson Technology for volume production of next-generation logic devices. The first tools from this order have recently been installed at the customer's new 300mm fab in Japan, where they join other Aspen III ICPHT tools installed earlier in 2004. Mattson's high-throughput strip systems will be used to support system-on-chip (SoC) and copper interconnect technologies for 65nm devices on 300mm wafers.

Leading European analog and mixed signal device firm has placed an order for a Tegal 980ACS (Advanced Control System) plasma etch system that will be used for high-volume fabrication in its new 200mm production facility. This follow-on order was based on the performance of the Tegal 900 and 6500 series tools currently used in production.

Leading Japanese wafer supplier has placed a multi-million-dollar order for wafer geometry systems from ADE Corporation. The order includes multiple WaferSight wafer flatness and multiple AFS(TM) systems for qualification and certification of critical wafer geometry parameters in support of 300mm bare wafer production capacity expansion plans.

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