Morocco-based wafer-level camera manufacturer Nemotek Technologie has placed a repeat order for EVG’s bonding and UV nanoimprint lithography (UV-NIL) systems – the EVG520IS and IQ Aligner. Nemotek will use these systems for production of CMOS image sensors and waferlevel optics that will be deployed in wafer-level cameras for mobile applications. EVG’s IQ Aligner is claimed to be the only high-volume manufacturing solution for wafer lens molding and stacking proven in production today.
“Demand continues to rise for wafer-level cameras, and we are ramping up our production capabilities in order to meet our customers’ needs,” said Jacky Perdrigeat, chief executive officer of Nemotek Technologie. “To support our production expansion efforts, we selected EV Group’s wafer bonding and UV-NIL systems not only for their high-volume capabilities, but also for their support of our preferred wafer-level technology process.”
Nemotek’s class 10 cleanroom, which already houses several EVG tools, including an EVG6200 bond aligner, a fully automated IQ Aligner UV-NIL system, an EVG520IS wafer bonder, and an EVG40NT metrology system. The two new tools will be installed in phases with the twobond chamber EVG520IS for CMOS image sensor manufacturing, to be completed this month. The second IQ Aligner UV-NIL system for micro-lens molding, bond alignment and UV bonding of micro-optics stacks will be installed later this year.