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Tool Order: Mattson‚??s Helios XP RTP system installed at Asia-based foundry‚??s R&D facility

24 August 2010 | By Mark Osborne | News > Wafer Processing

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A leading Asian foundry has installed a Helios XP rapid thermal processing (RTP) system from Mattson Technology at its R&D facility. The follow-on evaluation system expands Mattson's RTP installed base at this foundry where the Helios XP has been established as the tool of record and is currently being qualified for next-generation process development, according to the company.

"The Helios XP's thermal uniformity control across the broadest temperature range gives our customers a wider process flexibility in the same system lowering their cost-of-ownership, while the system's unique HotShield™ technology suppresses pattern loading and temperature effects, enabling improved device yield on advanced IC nodes,” commented Andreas Toennis, Senior Vice President and General Manager of Mattson Technology's Thermal Products Group.

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