Online information source for semiconductor professionals
Tool Order: Mattsonâ??s etch tool selected for wafer level packaging
Popular articles
New Product: Applied Materials new EUV reticle etch system provides nanometer-level accuracy - 19 September 2011
Oberai discusses Magma’s move into solar PV yield management space - 29 August 2008
â??Velocityâ?? the new buzzword in Intelâ??s PQS annual awards - 12 April 2012
Applied Materials adds Jim Rogers to Board of Directors - 29 April 2008
TSMC honors suppliers at annual Supply Chain Management Forum - 03 December 2008
A leading global semiconductor manufacturer has selected Mattson
Technology’s ‘Alpine’ etch system for advanced wafer-level packaging
applications. The system has been shipped to the manufacturer's newest
300mm packaging facility located in Asia, Mattson said.
“Their decision to place an Alpine etch system was based on proven performance from our earlier work with them,” commented Randy Matsuda, Senior Vice President and General Manager of Mattson Technology's Plasma Products Group. “This selection of our Alpine etch system is further validation of their continued confidence in Mattson's technology and its capabilities in meeting their requirements for the wafer-level packaging applications."
The Apline can now be used for processes related to wafer bumping and 3D packaging.