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Tool Order: Mattson‚??s etch tool selected for wafer level packaging

19 October 2009 | By Mark Osborne | News > Wafer Processing

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A leading global semiconductor manufacturer has selected Mattson Technology’s ‘Alpine’ etch system for advanced wafer-level packaging applications. The system has been shipped to the manufacturer's newest 300mm packaging facility located in Asia, Mattson said.

“Their decision to place an Alpine etch system was based on proven performance from our earlier work with them,” commented Randy Matsuda, Senior Vice President and General Manager of Mattson Technology's Plasma Products Group. “This selection of our Alpine etch system is further validation of their continued confidence in Mattson's technology and its capabilities in meeting their requirements for the wafer-level packaging applications."

The Apline can now be used for processes related to wafer bumping and 3D packaging.
 

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