A leading semiconductor manufacturer has placed a repeat order with Mattson Technology for its Alpine etch system. The system will be used in the unidentified customer's leading-edge 300mm packaging facility based in Asia for advanced wafer-level packaging processes. The system is scheduled to ship in November 2010.
"The Alpine was again selected by this leading semiconductor manufacturer for its ability to provide the process and technology solution for key etch steps to meet this customer's advanced packaging requirements," noted Rene George, Vice President and General Manager of Mattson Technology's Plasma Products Group. "The system's temperature and material removal control enable back-end wafer level packaging customers to address increasingly challenging integration processes related to wafer bumping and 3D packaging processes.