Online information source for semiconductor professionals

Tool order: Mattson receives repeat business for ‚??Alpine‚?? etch system

23 November 2010 | By Mark Osborne | News > Wafer Processing

Popular articles

Oberai discusses Magma’s move into solar PV yield management space - 29 August 2008

‚??Velocity‚?? the new buzzword in Intel‚??s PQS annual awards - 12 April 2012

Applied Materials adds Jim Rogers to Board of Directors - 29 April 2008

TSMC honors suppliers at annual Supply Chain Management Forum - 03 December 2008

Sematech Litho Forum: Sematech mulling multi-beam mask writer effort - 12 May 2010

A leading semiconductor manufacturer has placed a repeat order with Mattson Technology for its Alpine etch system. The system will be used in the unidentified customer's leading-edge 300mm packaging facility based in Asia for advanced wafer-level packaging processes. The system is scheduled to ship in November 2010.

"The Alpine was again selected by this leading semiconductor manufacturer for its ability to provide the process and technology solution for key etch steps to meet this customer's advanced packaging requirements," noted Rene George, Vice President and General Manager of Mattson Technology's Plasma Products Group. "The system's temperature and material removal control enable back-end wafer level packaging customers to address increasingly challenging integration processes related to wafer bumping and 3D packaging processes.

Related articles

Tool Order: Mattson receives strip tool order for 2X NAND flash node development - 10 November 2008

Tool Order: Mattson gains first Nexion etch system order - 26 March 2008

Tool Order: Mattson receives its largest etch tool order - 09 March 2011

Tool Order: Mattson receives follow-on multi-system orders for Etch and strip systems - 22 June 2011

Tool Order: Major DRAM manufacturer places follow-on order for Mattson‚??s etch system - 22 April 2009

Reader comments

No comments yet!

Post your comment

Name:
Email:
Please enter the word you see in the image below: