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Tool Order: Major logic foundry places follow-on order for Ultratech‚??s LSA systems

05 February 2010 | By Mark Osborne | News > Wafer Processing

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A Major logic foundry based in Asia has placed a multiple systems follow-on order with Ultratech for its laser spike anneal (LSA) tool. Ultratech's LSA100A systems will be used to support high-volume production for advanced logic devices in 2010. Ultratech said that all major logic foundries now used this tool.

"Our foundry customers require a cost-effective, advanced annealing solution that has the flexibility to process many different product layouts while maintaining high product yields,” commented Jeff Hebb, Ph.D, Ultratech's Vice President of Laser Product Marketing. “The unique technology of the LSA100A system has demonstrated that it can meet these critical requirements in a foundry environment, and is also extendible to the next two technology generations. Our LSA system provides uniform temperature and uniform process results that are independent of the device layout.”

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