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Tool Order: leading-edge IC manufacturing places multiple system order with Nanometrics

20 August 2009 | By Mark Osborne | News > Wafer Processing

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A leading-edge semiconductor manufacturer has placed a multiple system order with Nanometrics for its Atlas XP metrology system. The systems have been ordered with Nanometrics ‘NanoCD’ capability, which enables both film thickness and optical critical dimension (OCD) metrology. The tools are expected to be qualified in the third quarter of 2009.

“The challenges of leading edge semiconductor manufacturing methods have pushed many conventional technologies aside and require that the measurement of thin film thickness, profiles and device geometries occur directly on complex structures,” commented Bill McGahan, Director of OCD Technology Development at Nanometrics. “Additionally, the rapidly changing process environment necessitates a system and software solution to support robust recipe development. By combining the full NanoCD suite, including our NanoDiffract software, NanoGen cluster computing solutions and Atlas XP metrology systems, our customer has a path to accurate and precise process monitoring in a dynamic and rapidly evolving development line.”

Nanometrics now claims to have OCD solutions in every segment of the fab including lithography, etch, chemical mechanical polishing (CMP) and thin film deposition. This also applies to device types and technology node from 65nm to 22nm.

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