Online information source for semiconductor professionals
Tool Order: Lam reaches 3,000th single-wafer spin system shipment
Popular articles
â??Velocityâ?? the new buzzword in Intelâ??s PQS annual awards - 12 April 2012
Oberai discusses Magma’s move into solar PV yield management space - 29 August 2008
New Product: Applied Materials new EUV reticle etch system provides nanometer-level accuracy - 19 September 2011
Applied Materials adds Jim Rogers to Board of Directors - 29 April 2008
TSMC honors suppliers at annual Supply Chain Management Forum - 03 December 2008
A new shipment milestone has been reached at Lam Research with its 3,000th single-wafer ‘SEZ’ spin clean technology process module being shipped to leading DRAM manufacturer. Lam said the new milestone maintains its position as having the largest installed base of single-wafer wet clean modules in the market place.“This milestone shipment demonstrates customer confidence in the advanced capability delivered by recent innovations in our spin clean design,” commented Jeff Marks, Vice President and General Manager, Clean Product Group, Lam Research. “All of our recently shipped FEOL spin clean modules are configured with multiple chemistries and customers are reporting that we provide greater flexibility in chemical management on our spin clean platforms than our competitors.”
Lam said that the wafer cleaning system was selected for its multi-chemistry flexibility and advanced capabilities, including new drying technology that minimizes collapse of fragile features.