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Tool Order: Korean Research Centre selects EV Group’s wafer bonder

29 September 2009 | By Mark Osborne | News > Wafer Processing

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Korean Research Centre and foundry services provider, RFID/USN has selected EV Group's ‘GEMINI’ wafer bonder that will be used to develop and pilot produce stacked 3D MEMS devices. EVG claims a 75% market share of wafer bonding business.

"As a foundry service provider, we strive to offer our customers with cutting-edge technologies to support their 3D MEMS production needs, and as such, require a flexible system that can adapt to a wide range of requirements," said RFID/USN Center's executive director, Dong-suk Han. "Given the stringent demands of the leading-edge MEMS market, particularly for 3D devices, we evaluated a number of bonding solutions on the market for MEMS production, and in the end, chose EVG's GEMINI not only for its superior reliability and high-volume capabilities, but also for its flexibility and extendibility. The GEMINI enables us to quickly adjust the chuck to handle both 6- and 8-inch wafers, offering the highest available uptime in the market to ensure around-the-clock operation--a significant factor in our decision."

EV Group formed a Korean subsidiary in the summer of 2008, and noted that it is now seeing ‘positive momentum’ in that market.

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