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Tool Order: Jordan Valley wins X-ray metrology tool order for copper processing

16 December 2009 | By Mark Osborne | News > Wafer Processing

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A tier-1 fab in East Asia has placed multiple orders for Jordan Valley's JVX 6200 X-ray metrology tool for measuring copper process control (copper and seed barrier). Samsung and TSMC have already adopted the company’s 6200 system. The platform can be utilized for advanced process control at the back-end of line (BEOL) as well as the front end of line (FEOL).

Isaac Mazor, Jordan Valley's President and CEO"The closer we get to the upturn in the global semiconductor market, the more urgent it becomes for fabs to invest in high quality metrology systems such as our JVX 6200," noted Isaac Mazor, Jordan Valley's President and CEO. "This recent move by the tier-1 Asian fab demonstrates these companies' awareness of the critical role that our metrology tools play in their ability to meet the surge in demand for chips we all expect in 2010."

JVX 6200 platform can include up to three metrology channels on a single system: XRR (X-Ray Reflectivity), XRF (X-Ray Fluorescence) and SAXS (Small Angle X-Ray Scattering) for high-speed and non-destructive characterization of all film types.

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