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Tool order: Hynix places order for Mattson’s RTP system
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Mattson
Technology, Inc. has revealed that it has shipped one of its
dual-chamber 300mm rapid thermal processing (RTP) systems to Hynix
Semiconductor, Inc.'s R3 memory R&D facility in Korea. The system
is currently being installed in Hynix’s facility, will aid in meeting
the company’s increased process requirements for high-volume chip
manufacturing through the 45nm technology node and beyond.
"We have enjoyed a long relationship with Hynix, and their selection of our advanced RTP system is further validation of their continued confidence in Mattson's technology and its capabilities in meeting their advanced process requirements and next-generation nanometer flash memory devices development,” said Andreas Toennis, Senior Vice President and General Manager, Mattson Technology's Thermal Division. “We are pleased to continue our partnership with Hynix and look forward to further supporting their future technology node development."