Online information source for semiconductor professionals

Tool Order: FSI‚??s new ‚??ORION‚?? single wafer cleaning system in 32nm BEOL evaluation

20 May 2008 | By Mark Osborne | News > Wafer Processing

Popular articles

Oberai discusses Magma’s move into solar PV yield management space - 29 August 2008

New Product: Applied Materials new EUV reticle etch system provides nanometer-level accuracy - 19 September 2011

‚??Velocity‚?? the new buzzword in Intel‚??s PQS annual awards - 12 April 2012

Applied Materials adds Jim Rogers to Board of Directors - 29 April 2008

TSMC honors suppliers at annual Supply Chain Management Forum - 03 December 2008

ORIONA major semiconductor manufacturer has selected a single wafer cleaning system dubbed ‘ORION’ from FSI International, which has yet to be officially announced. The tool will be used for 32nm BEOL cleaning processes that specifically handle low-k materials.

“We have taken a very deliberate approach in the development of our single wafer cleaning technology, focusing on translating our considerable experience and expertise into a tool that will meet the industry’s advancing requirements,” commented Don Mitchell, FSI chairman and CEO.

Related articles

Tool Order: FSI wins new order from initial ORION cleaning tool customer - 07 January 2009

Tool Order: FSI International wins repeat order from foundry - 07 July 2011

Tool Order: U.S.-based IC manufacturer places follow-on Orion order with FSI - 07 October 2009

Tool Order: FSI to supply ‚??ORION‚?? single wafer cleaning system - 18 March 2010

Tool Order: FSI receives acceptance confirmation of new ‚??ORION‚?? cleaning tool - 24 December 2008

Reader comments

No comments yet!

Post your comment

Name:
Email:
Please enter the word you see in the image below: