Online information source for semiconductor professionals
Tool Order: FSI wins new order from initial ORION cleaning tool customer
Popular articles
New Product: Applied Materials new EUV reticle etch system provides nanometer-level accuracy - 19 September 2011
Oberai discusses Magma’s move into solar PV yield management space - 29 August 2008
â??Velocityâ?? the new buzzword in Intelâ??s PQS annual awards - 12 April 2012
Applied Materials adds Jim Rogers to Board of Directors - 29 April 2008
New Product: ASML Brionâ??s Tachyon MB-SRAF enables OPC-like compute times - 19 September 2011
In quick succession, FSI International has received a follow-on order from the initial customer for its new enclosed chamber, ORION single wafer cleaning platform. The second tool will be used for a wider range of tasks compared to the original tool that went under a detailed evaluation process before being accepted for volume manufacturing for 32nm copper interconnect applications. The second system will be employed for BEOL copper/low-k interconnect cleaning.
“This order is especially important to us as it validates the use of our ORION technology in manufacturing,” said Don Mitchell, FSI’s president and CEO. “This customer had initially evaluated our new single wafer technology for BEOL 32nm processes. Their experience with the ORION system’s performance was sufficient for them to extend its value to existing manufacturing. The order reassures us that, even in the current industry downturn, our customers are willing to invest in new technology that delivers superior performance and clear economic benefits.”
FSI announced the acceptance of the first ORION tool sold in December 2008.