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Tool Order: FSI wins new order from initial ORION cleaning tool customer

07 January 2009 | By Mark Osborne | News > Wafer Processing

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In quick succession, FSI International has received a follow-on order from the initial customer for its new enclosed chamber, ORION single wafer cleaning platform. The second tool will be used for a wider range of tasks compared to the original tool that went under a detailed evaluation process before being accepted for volume manufacturing for 32nm copper interconnect applications. The second system will be employed for BEOL copper/low-k interconnect cleaning.

“This order is especially important to us as it validates the use of our ORION technology in manufacturing,” said Don Mitchell, FSI’s president and CEO. “This customer had initially evaluated our new single wafer technology for BEOL 32nm processes. Their experience with the ORION system’s performance was sufficient for them to extend its value to existing manufacturing. The order reassures us that, even in the current industry downturn, our customers are willing to invest in new technology that delivers superior performance and clear economic benefits.”

FSI announced the acceptance of the first ORION tool sold in December 2008.


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