A major semiconductor manufacturer based in Asia has selected an ‘ORION’ single wafer cleaning system from FSI International to meet anticipated resist stripping requirements for front-end-of-line (FEOL) cleaning processes in advanced IC manufacturing. FSI expects to ship this evaluation FSI ORION single wafer cleaning system to this customer during its fiscal 2010 third quarter.
“With this order we have accomplished a key fiscal 2010 objective to place FSI ORION systems at strategic logic, memory and foundry producers,” said Don Mitchell, FSI Chairman and Chief Executive Officer. “We have taken a very deliberate approach in the development of our single wafer cleaning technology, focusing on translating our considerable experience and expertise into a tool that will meet the industry’s advancing surface conditioning requirements.”
The ORION system has a unique closed chamber design, which permits safe use of aggressive, high-temperature ViPR process technology for all-wet removal of highly implanted photoresist.