Europe’s first 200mm MEMS fab, currently under construction in Sweden by Silex Microsystems, will install EV Group’s (EVG) GEMINI automated bond cluster, an EVG 6200NT mask and bond aligner and EVG301 mask cleaner, in the spring of 2009. EVG said that this was a follow-on order from the MEMS foundry.
"Our company is dedicated to bringing advanced process technologies and manufacturing excellence to our nearly 80 customers worldwide," said Jan Nerdal, Silex CEO. "As a pure-play MEMS manufacturer, we expect only the best from our suppliers when it comes to delivering cost-effective yet superior process capabilities, quality and support. EVG has been a valued supplier to Silex since we commenced operations in 2000 -- consistently delivering over this time, the wafer bonding and aligner solutions we've needed to manufacture our myriad best-in-class MEMS devices. Our recent order with EVG demonstrates the confidence we have in them toward helping us effectively transition from semi-automatic wafer bonding to fully automated production at our prized 8-inch MEMS fab-seamlessly and efficiently."
“Our longstanding relationship with Silex and recent follow-on order win speaks volumes to the satisfaction shared among today's MEMS community in our ability meet today's exacting MEMS manufacturing requirements," commented Paul Lindner, EVG's Executive Technology Director.