Electronic components, modules and systems manufacturer EPCOS has placed an order for EV Group’s GEMINI platform, a production manufacturing solution for high-volume wafer bonding applications for MEMS, 3D IC integration and advanced packaging. The tool will be installed at EPCOS's production facility in Munich, Germany for the manufacture of surface acoustic wave (SAW) filters embedded in RF devices.
The GEMINI fully-automated wafer bonding system is claimed to integrate EVG's precision alignment accuracy and wafer handling expertise into one wafer bonding platform. There have been more than 100 of the systems installed in fabs worldwide.
"As we continue to innovate and further strengthen our SAW filter product portfolio, we are looking to partner with equipment suppliers who can address our stringent performance needs," said EPCOS's Christian Bauer, process development, SAW components. "Simultaneously, we're also looking for suppliers that offer flexible solutions along with value-added process expertise that will enable us to explore emerging markets, such as MEMS. Ultimately, we selected EVG's GEMINI bonder as it offered us superior process reliability, as well as throughput and yield in line with our requirements."