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Tool order: EV Group completes two follow-on orders for fusion bonding systems

06 October 2009 | By Síle Mc Mahon | News > Wafer Processing

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EV Group's Gemini fusion bonderWafer bonding and lithography equipment provider EV Group has announced its completion of the installation of two automated fusion bonding systems for 300mm wafers. The Gemini FB systems are destined for use in producing backside illuminated CMOS image sensors.

The two follow-on orders saw the Gemini systems shipped to a major foundry and to a major consumer electronics manufacturer, both of which were unnamed.

“We are thrilled to have received follow-up orders for our Gemini FB fusion bonding system from two very important customers, who are leading the charge in advanced, backside illuminated CMOS image sensor development and manufacturing,” commented Paul Lindner, EVG's executive technology director.

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