Online information source for semiconductor professionals
Tool order: EV Group completes two follow-on orders for fusion bonding systems
Popular articles
â??Velocityâ?? the new buzzword in Intelâ??s PQS annual awards - 12 April 2012
Oberai discusses Magma’s move into solar PV yield management space - 29 August 2008
Applied Materials adds Jim Rogers to Board of Directors - 29 April 2008
TSMC honors suppliers at annual Supply Chain Management Forum - 03 December 2008
New Product: Applied Materials new EUV reticle etch system provides nanometer-level accuracy - 19 September 2011
Wafer bonding and lithography equipment provider EV Group has announced its completion of the installation of two automated fusion bonding systems for 300mm wafers. The Gemini FB systems are destined for use in producing backside illuminated CMOS image sensors.
The two follow-on orders saw the Gemini systems shipped to a major foundry and to a major consumer electronics manufacturer, both of which were unnamed.
“We are thrilled to have received follow-up orders for our Gemini FB fusion bonding system from two very important customers, who are leading the charge in advanced, backside illuminated CMOS image sensor development and manufacturing,” commented Paul Lindner, EVG's executive technology director.