Online information source for semiconductor professionals

Tool Order: Avago to use Rudolph‚??s NSX inspection systems for optoelectronic devices

04 February 2011 | By Mark Osborne | News > Wafer Processing

Popular articles

Oberai discusses Magma’s move into solar PV yield management space - 29 August 2008

‚??Velocity‚?? the new buzzword in Intel‚??s PQS annual awards - 12 April 2012

Applied Materials adds Jim Rogers to Board of Directors - 29 April 2008

TSMC honors suppliers at annual Supply Chain Management Forum - 03 December 2008

Sematech Litho Forum: Sematech mulling multi-beam mask writer effort - 12 May 2010

Avago Technologies Singapore fab has selected another Rudolph Technologies NSX inspection system for front-end inspection for its advanced optoelectronic devices. The first NSX System shipped in the fourth quarter of 2010, while the latest tool order will ship this quarter.

“As our production volumes scale up, we have turned increasing attention to improving process yields,” commented Tom White, Avago’s worldwide director of Optoelectronics Devices Operation. “The NSX System will allow us to improve the reliability and repeatability of our inspection procedures and our operation efficiency. In addition, we are using the Rudolph tools to measure critical dimension and overlay metrics at a significant cost savings over standalone metrology tools.”

Related articles

Tool Order: Singapore fab places multiple inspection system order with Rudolph - 08 May 2008

Professor Ching-Ting Lee elected as IEEE fellow - 04 December 2008

Avago Technologies cuts 400 jobs mainly from Asian workforce - 25 September 2007

Order Focus: Camtek get follow-on order for Gannet system from Asia-based IDM - 03 May 2011

Tool order: Taiwanese foundry places multiple CMP inspection systems order with Rudolph - 08 December 2009

Reader comments

No comments yet!

Post your comment

Name:
Email:
Please enter the word you see in the image below: