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Tool Order: Asia-based foundry evaluating FSI‚??s ANTARES CryoKinetic cleaning system

11 January 2011 | By Mark Osborne | News > Wafer Processing

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ANTARES CryoKinetic cleaning systemAn Asian foundry has ordered an ANTARES CryoKinetic cleaning system from FSI International that will be used for particle removal after in-line wafer testing and other high defectivity steps. The system is expected to ship in January 2011, according to the company. The system can be used for a variety of particle removal applications in FEOL and BEOL.

CryoKinetic processing technology is an all-dry, non-reactive process that removes particles through impact by high-velocity cryogenic Ar/N2 aerosol, and reduces defects without damaging the wafer surface, even on copper and porous low-k films.

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