Fraunhofer IZM Institute has ordered a 300mm ‘AltaCVD’ system from equipment supplier Altatech Semiconductor. The tool will be used at the newly opened All Silicon System Integration Dresden (ASSID), a leading-edge microelectronic packaging and system integration center run by the Fraunhofer IZM Institute to develop next-generation through silicon vias (TSV). The equipment is scheduled to go online in the third quarter of this year.
“ASSID’s order confirms that our platform, chambers and processes are fulfilling today’s most demanding requirements for advanced materials deposition,” said Jean-Luc Delcarri, president of Altatech Semiconductor. “Our low-temperature processing and innovative vaporization technology for liquid precursors makes AltaCVD uniquely qualified to deposit the films required for TSV and microsystems integration.”