Online information source for semiconductor professionals
Tool Order: Altatech to supply Fraunhofer institute with CVD system for SOI deposition
Popular articles
â??Velocityâ?? the new buzzword in Intelâ??s PQS annual awards - 12 April 2012
Oberai discusses Magma’s move into solar PV yield management space - 29 August 2008
Applied Materials adds Jim Rogers to Board of Directors - 29 April 2008
TSMC honors suppliers at annual Supply Chain Management Forum - 03 December 2008
New Product: Applied Materials new EUV reticle etch system provides nanometer-level accuracy - 19 September 2011
The Fraunhofer Research Institution for Modular Solid State Technology EMFT in Munich has placed an order for a 200mm AltaCVD system from Altatech Semiconductor. The system will be used for depositing dielectric layers and layer stacks on silicon and silicon-on-insulator (SOI) wafers. Installation is expected by the second quarter of 2011.“Our highly flexible AltaCVD platform continues to generate orders from R&D leaders and chipmakers around the world. We are pleased with the acceptance of the reactor for high-k oxide and metal deposition processes and low-temperature TSV films,” said Jean-Luc Delcarri, president of Altatech Semiconductor.
According to Altatech its AltaCVD platform allows it to be used for sub-atmospheric-pressure deposition (SACVD) of ultrathin conformal isolation layers inside deep vias and trenches with aspect ratios as high as 40:1.