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Tool Order: Altatech to supply Fraunhofer institute with CVD system for SOI deposition

08 February 2011 | By Mark Osborne | News > Wafer Processing

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200mm AltaCVD systemThe Fraunhofer Research Institution for Modular Solid State Technology EMFT in Munich has placed an order for a 200mm AltaCVD system from Altatech Semiconductor. The system will be used for depositing dielectric layers and layer stacks on silicon and silicon-on-insulator (SOI) wafers. Installation is expected by the second quarter of 2011.

“Our highly flexible AltaCVD platform continues to generate orders from R&D leaders and chipmakers around the world. We are pleased with the acceptance of the reactor for high-k oxide and metal deposition processes and low-temperature TSV films,” said Jean-Luc Delcarri, president of Altatech Semiconductor.

According to Altatech its AltaCVD platform allows it to be used for sub-atmospheric-pressure deposition (SACVD) of ultrathin conformal isolation layers inside deep vias and trenches with aspect ratios as high as 40:1.

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