The Fraunhofer Research Institution for Modular Solid State Technology EMFT in Munich has placed an order for a 200mm AltaCVD system from Altatech Semiconductor. The system will be used for depositing dielectric layers and layer stacks on silicon and silicon-on-insulator (SOI) wafers. Installation is expected by the second quarter of 2011.
“Our highly flexible AltaCVD platform continues to generate orders from R&D leaders and chipmakers around the world. We are pleased with the acceptance of the reactor for high-k oxide and metal deposition processes and low-temperature TSV films,” said Jean-Luc Delcarri, president of Altatech Semiconductor.
According to Altatech its AltaCVD platform allows it to be used for sub-atmospheric-pressure deposition (SACVD) of ultrathin conformal isolation layers inside deep vias and trenches with aspect ratios as high as 40:1.