Online information source for semiconductor professionals
TOK to develop EUV photoresists at SEMATECH
Popular articles
New Product: Applied Materials new EUV reticle etch system provides nanometer-level accuracy - 19 September 2011
Oberai discusses Magma’s move into solar PV yield management space - 29 August 2008
â??Velocityâ?? the new buzzword in Intelâ??s PQS annual awards - 12 April 2012
Applied Materials adds Jim Rogers to Board of Directors - 29 April 2008
TSMC honors suppliers at annual Supply Chain Management Forum - 03 December 2008
Tokyo Ohka Kogyo Co., Ltd. (TOK) has joined SEMATECH’s Resist Materials and Development Center (RMDC) at the College of Nanoscale Science and Engineering (CNSE) of the University at Albany to develop 22nm and below photoresists for extreme ultraviolet (EUV) lithography.
“The RMDC brings together the critical capabilities needed to enable manufacturable EUV,” said Bryan Rice, director of Lithography at SEMATECH. “Partnering with resist suppliers such as TOK will accelerate EUV resist development and, in turn, will support timely EUVL introduction.”