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TOK to develop EUV photoresists at SEMATECH
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Tokyo Ohka Kogyo Co., Ltd. (TOK) has joined SEMATECH’s Resist Materials and Development Center (RMDC) at the College of Nanoscale Science and Engineering (CNSE) of the University at Albany to develop 22nm and below photoresists for extreme ultraviolet (EUV) lithography.
“The RMDC brings together the critical capabilities needed to enable manufacturable EUV,” said Bryan Rice, director of Lithography at SEMATECH. “Partnering with resist suppliers such as TOK will accelerate EUV resist development and, in turn, will support timely EUVL introduction.”