Online information source for semiconductor professionals

The Foundry Company details capex & future processing roadmap

13 November 2008 | By Mark Osborne | News > Fab Management

Popular articles

Oberai discusses Magma’s move into solar PV yield management space - 29 August 2008

Applied Materials adds Jim Rogers to Board of Directors - 29 April 2008

Sematech Litho Forum: Sematech mulling multi-beam mask writer effort - 12 May 2010

TSMC honors suppliers at annual Supply Chain Management Forum - 03 December 2008

TSMC hosts 2008 Green Forum on ‘green’ factories - 31 October 2008

The Foundry Company capacity rampThe Foundry Company, formally AMD’s manufacturing facilities in Dresden, Germany has revealed certain details regarding its future plans at AMD’s investor conference held earlier today. Doug Grose, the new CEO of The Foundry Company highlighted that capital spending for 2009 would be $900 million, which will primarily target the first phase tool install and start-up operations at Fab38 by the end of 2009 with volume production expected in 2010. Spending will also go to Fab36 for the full fab conversion to 45nm process technology and certain start-up construction costs related to Fab 4X.

Grose said that an additional $300 million will be spent on R&D, sales & marketing, design enablement and IT, related to establishing its foundry operations.

Fab capacity for 2009 is reliant on Fab 36, which is expected to above 25,000wspm, or more than 300,000 300mm wafers per annum. In 2010, this is expected to increase to over 400,000 wafers per annum as Fab 38 continues to ramp at a total cost of $2 billion and reach capacity of 25,000wspm, according to Grose. In 2011, total annual wafer capacity is put at close to 600,000, 300mm wafers.Fab capacity for 2009 is reliant on Fab 36

Fab 4X is expected to come online in 2012, using 22nm process technology. The Foundry Company expects the major ramp to be in 2013, taking total wafer capacity to over 800,000. Total spending on Fab 4X is expected to $4 billion. 

The Foundry Company is also planning to introduce a 32nm Bulk CMOS process at Fab 38 in Q409 that will initially be used for GPU production for AMD. Interestingly, The Foundry Company is planning a 32nm Bulk CMOS HKMG low power option in the first-half of 2010, which could be significantly earlier than its major rivals, TSMC, UMC, SMIC and Chartered Semiconductor.

A 32nm SOI high performance process using high-k and metal gates (HKMG) at Fab 36 will be introduced in the first-half of 2010 for AMD’s microprocessors, just 15 months after 45nm volume production started, if execution is in the first quarter.

 The Foundry Company is planning a 32nm Bulk CMOS HKMG low power option in the first-half of 2010

 

Related articles

Interconnect and Dielectric Technologies – What’s Actually Being Made and Sold? - 01 March 2002

Tool Order: TSMC places US$76 million order with ASML - 27 January 2011

UMC puts US$400 million cap on CapEx for 2009: fab utilization rate at 30% - 30 April 2009

SMIC to spend US$1 billion on capital expenditure in 2011 - 18 February 2011

Micron cuts capex with Singapore NAND fab remaining on hold - 02 October 2008

Reader comments

No comments yet!

Post your comment

Name:
Email:
Please enter the word you see in the image below: