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TEL licenses ALD batch technology from ASM International

22 December 2008 | By Mark Osborne | News > Wafer Processing

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Tokyo Electron Limited (TEL) has signed a licensing agreement with ASM International covering the Dutch firm's currently filed and issued Atomic Layer Deposition (ALD) patents. TEL plans to use the license to offer batch reactor processes to its customers for sub-32nm applications. TEL’s main single wafer CVD tool is based on the Trias platform.

"TEL recognizes the industry migration to finer geometries where ALD technology plays a vital role, especially in the sub-32nm regime,” noted Mr. Hiroshi Takenaka, Corporate Director and Senior Vice President of Tokyo Electron. “The licensing of the ALD patents from ASMI will complement TEL's pursuit of enabling critical technologies in a batch reactor platform that also meets the high-productivity and cost-competitive metrics of our customers."

"By licensing global enterprises such as TEL with certain rights to our advanced ALD IP portfolio, we are further facilitating the adoption of this cost-effective, breakthrough technology to a broader marketplace, which will not only benefit our companies, but the semiconductor industry overall," commented  Dr. Albert Hasper, General Manager of ASM Europe.

The detailed terms of the agreement were not disclosed.

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