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TEL and Edwards to develop PFC abatement system for dielectric film etching processes

25 November 2008 | By Mark Osborne | News > Wafer Processing

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Tokyo Electron Limited (TEL) Telius Etch toolEdwards and Tokyo Electron Limited (TEL) are to jointly develop a perfluorocarbon (PFC) gas abatement system dielectric film etching processes that will also be able to abate carbon monoxide. The ‘PA-01E’ abatement tool will also be developed with input from Adtec Plasma Technology Co., Ltd., of Japan.

“The contribution of PFC gases to global warming has been extensively documented, and we look forward to working with TEL’s engineering staff to provide an effective, low cost-of-ownership gas abatement system specifically designed to reduce the dangers of PFC pollution as a result of the semiconductor etch process,” commented Nigel Hunton, Edwards’ CEO.

The equipment is being designed to have a lower cost-of-ownership than traditional abatement technologies, focusing on a reduction in energy usage, consumables and maintenance, according to Edwards.

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