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Tegal, EV Group land orders for MEMS tools

20 January 2009 | By Tom Cheyney | News > Wafer Processing

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tegal_endeavorTegal and EV Group have both landed orders for their process equipment from major MEMS device manufacturers.

A Tegal Endeavor AT PVD cluster tool (pictured here) will be shipped to a leading MEMS image sensor producer in the first-quarter 2009. The ultra-high-vacuum sputtering system will be employed for backside metallization applications in the customer's process optimization and high-volume manufacturing activities.

An EVG LT810 low-temperature plasma activation system will be shipped and installed at Samsung Electro-Mechanics Co. (SEMCO) in March. The single-chamber, high-surface-energy bonding tool will be used for R&D work on stacked and 3-D MEMS devices.

  

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