Online information source for semiconductor professionals

Taiwan‚??s President weighs up easing 300mm restrictions

08 June 2009 | By Síle Mc Mahon | News > Fab Management

Popular articles

Oberai discusses Magma’s move into solar PV yield management space - 29 August 2008

‚??Velocity‚?? the new buzzword in Intel‚??s PQS annual awards - 12 April 2012

Applied Materials adds Jim Rogers to Board of Directors - 29 April 2008

TSMC honors suppliers at annual Supply Chain Management Forum - 03 December 2008

Sematech Litho Forum: Sematech mulling multi-beam mask writer effort - 12 May 2010

President MaThe continuation of the ruling preventing the establishment of 300mm fabs by Taiwanese semiconductor companies in China may be set for a redress, according to a report in the Associated Press. Current President of Taiwan Ma Ying-jeou has carried on the restrictions introduced by his predecessor Chen Shui-bian, who brought in laws to prevent the transfer of high technology to China.

Should the move go ahead, it would mean a major boost for Taiwan’s economic ties with mainland China. President Ma’s leadership of the past 11 months has seen him make several attempts at improving trade relations between the province and the mainland.

President Ma Ying-jeou was quoted in the report as having commented that the island was "not excluding the possibility" of welcoming companies to establish 300mm fabs. Currently, only 200mm fabs are allowed to be established by Taiwanese companies in China.

Rumours are abounding that the Taiwanese government is planning to officially announce the turnaround in July of this year.

A further report in the Taiwan News states that the semiconductor industry is "Taiwan's economic lifeline", and as such, it should not be tampered with. It also claims that the move to allow 300mm fabs to move to the mainland will result only in slightly higher profit margins, with negative results such as Taiwanese job losses, shifting of technology know-how from the province and a loss in potential for future technology developments.

Related articles

AMD capacity constrained at TSMC - 22 January 2010

Asian chip manufacturers receive boost from Qimonda‚??s woes - 28 January 2009

Environmental Requirements Applicable to Copper-Based Semiconductor Deposition Processes in the… - 01 December 1999

Short-Interval Detailed Production scheduling in 300mm semiconductor manufacturing using Mixed In-te - 01 December 2006

TI snags more bargains with purchase of 2 fabs from Spansion Japan - 15 July 2010

Reader comments

No comments yet!

Post your comment

Please enter the word you see in the image below: