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SUSS MicroTec ships 300mm TSV tool to Japan

25 August 2009 | By Mark Osborne | News > Lithography

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SUSS MicroTec has shipped and installed a LithoPack300 lithography cluster to a customer in Japan, which will be used for 3D IC integration technology development. The cluster tool includes coat, bake, expose and develop modules for wafers up to 300mm.

"In recent years SUSS MicroTec lithography systems have developed into an enabling platform for next generation 3D Integration technologies", commented Rolf Wolf, general manager of SUSS MicroTec's lithography division. "Today SUSS Mask Aligners can be enhanced with tooling for submicron alignment, wafer edge handling or UV-bonding for wafer to wafer stacking, all features that have become critically important for 3D applications.

"With the involvement of SUSS MicroTec in international research cooperations we are proud to become further involved in 3D integration process development." noted Raymond Lau, Business Manager for SUSS MicroTec in Japan. "Our Japanese customers will directly benefit from these technical advances. We enjoy being able to offer a well-engineered solution portfolio for 3D integration that really meets their specific needs."

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