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SUSS MicroTec joins FEP program at SEMATECH

10 December 2009 | By Mark Osborne | News > Wafer Processing

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SUSS MicroTec has joined the Front End Processes (FEP) program at SEMATECH to work with device and reliability experts to investigate complex semiconductor probing and measurement solutions for next-generation semiconductor and emerging technologies that are using new materials and device structures.

“This collaboration represents an innovative blend of SUSS’ experience in test solutions for probing and characterization applications and SEMATECH’s strengths in the development of fundamental materials and advanced device technologies,” noted Frank P. Averdung, President and CEO of SUSS MicroTec.

SUSS MicroTec and SEMATECH’s FEP research teams will aim to develop new characterization techniques to enable both CMOS scaling and emerging technologies beyond CMOS.

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