Online information source for semiconductor professionals
SUSS MicroTec joins FEP program at SEMATECH
Popular articles
New Product: Applied Materials new EUV reticle etch system provides nanometer-level accuracy - 19 September 2011
Oberai discusses Magma’s move into solar PV yield management space - 29 August 2008
â??Velocityâ?? the new buzzword in Intelâ??s PQS annual awards - 12 April 2012
Applied Materials adds Jim Rogers to Board of Directors - 29 April 2008
New Product: ASML Brionâ??s Tachyon MB-SRAF enables OPC-like compute times - 19 September 2011
SUSS MicroTec has joined the Front End Processes (FEP) program at SEMATECH to work with device and reliability experts to investigate complex semiconductor probing and measurement solutions for next-generation semiconductor and emerging technologies that are using new materials and device structures.“This collaboration represents an innovative blend of SUSS’ experience in test solutions for probing and characterization applications and SEMATECH’s strengths in the development of fundamental materials and advanced device technologies,” noted Frank P. Averdung, President and CEO of SUSS MicroTec.
SUSS MicroTec and SEMATECH’s FEP research teams will aim to develop new characterization techniques to enable both CMOS scaling and emerging technologies beyond CMOS.