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STMicroelectronics to use Globalfoundries 40nm low power process

29 July 2009 | By Mark Osborne | News > Wafer Processing

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Globalfoundries has secured its first customer outside that of AMD. The foundry spin-off has said that STMicroelectronics would become the first customer of its 40nm low power Bulk CMOS process technology with IC devices aimed at wireless applications. First tape out and production for STMicroelectronics is expected to start sometime in 2010.

“To ensure ample capacity for our customer/partners at the leading-edge of low-power design, ST needs an agile and high-performance manufacturing partner that can adapt to our changing needs,” said Jean-Marc Chery, Executive Vice President, Chief Technology Officer, STMicroelectronics. “With a strong commitment to manufacturing and technology excellence at the leading-edge, we believe GLOBALFOUNDRIES is an excellent partner to collaborate on low-power design innovation in 2010 and beyond.”

It is understood that Globalfoundries Bulk CMOS processes will occupy the foundries second 300mm fab in Dresden, Germany. Typically, it would take approximately 12 months for tape out. Its first 300mm fab continues to operate as a dedicated SOI wafer facility, currently dedicated to the needs of AMD and the fabrication of microprocessors.

Globalfoundries is targeting only major IDM’s and fables companies that have a need for leading-edge processes and volume production.

STMicroelectronics has adopted an ‘asset-lite’ strategy in regard to leading-edge process requirements and has partnered with other foundries in recent years for varying IC devices.

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Reader comments

This gives some hope to GloFo. Does anyone knows what is the ST specific IC product moved to GloFo or its estimated wsm volume?
By Adolfo Gutierrez on 29 July 2009

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