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STMicroelectronics and NXP JV takes off as ST-NXP Wireless

27 June 2008 | By Síle Mc Mahon | News > Fab Management

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A. DutheilA joint venture between STMicroelectronics and NXP Semiconductor was confirmed yesterday and will be known as ST-NXP Wireless. The JV company combines the mobile and wireless businesses of the two companies and will target operations at the 2G, 2.5G, 3G, multimedia connectivity and wireless technologies. The JV agreement will be completed in the third quarter of 2008. 

With a combined revenue of $3 billion in 2007, the two companies forming the ST-NXP Wireless JV boast the potential to be in an ideal position to invest in the research required to develop new wireless technologies. Headquartered in Switzerland, the new company will incorporate design, sales, marketing and back-end manufacturing assets from both STMicroelectronics and NXP while utilising the companies’ foundries and wafer fabrication facilities.

"The new name, ST-NXP Wireless, clearly illustrates the joining together of two complementary and formidable forces in the worldwide market to create a new global wireless powerhouse," said Alain Dutheil (pictured), designated CEO, ST-NXP Wireless. "Our new company will be uniquely positioned to continue and extend customer relationships with the key players in the mobile and wireless industry, leveraging the passion and expertise of what is one of the best pools of talents in the industry."

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