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Spansion to use Sokudo’s RF3S track for 32nm immersion development

21 February 2008 | By Síle Mc Mahon | News > Lithography

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SpansionSpansion will use Sokudo's RF3S immersion track system at its 300mm Submicron Development Center (SDC) in Sunnyvale, CA to develop 193nm immersion processes for its 32nm flash devices. 

“We have performed a thorough evaluation of available track tools to support Spansion's second generation immersion lithography technology and have selected the RF3S based on its exceptional performance and competitive cost," said John Behnke, Vice President of Process Development and Transfer at Spansion. "This alliance demonstrates the industry's growing need for early collaboration. The close proximity of the SDC, which is the only full-flow 300mm process/product development line in the Silicon Valley, to Sokudo's development site at Applied Materials' Maydan Technology Center, will serve to strengthen the effectiveness of our development teams. We look forward to working together with Sokudo to develop our next generations of world-class Flash technology to meet the expanding needs and challenges of our customers.”

“This agreement will provide Sokudo with an opportunity to qualify our immersion technology for leading flash memory applications,” commented Takashige Suetake, CEO of Sokudo. “We are excited to be working with Spansion and believe that this collaboration will help to ensure that benchmark process and immersion defect control is available for 32nm immersion processes.”

According to Sokudo, its RF3S system demonstrated less than 1.0nm 3 sigma critical dimension (CD) uniformity on 45nm features and immersion defect density of less than 0.1 defects/cm2. It has an integrated wafer cleaning station, which is required for immersion applications.

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