Online information source for semiconductor professionals
Spansion and SK Hynix announce NAND partnership
Popular articles
New Product: Applied Materials new EUV reticle etch system provides nanometer-level accuracy - 19 September 2011
Oberai discusses Magma’s move into solar PV yield management space - 29 August 2008
â??Velocityâ?? the new buzzword in Intelâ??s PQS annual awards - 12 April 2012
Applied Materials adds Jim Rogers to Board of Directors - 29 April 2008
TSMC honors suppliers at annual Supply Chain Management Forum - 03 December 2008
Spansion and SK Hynix have announced that they will work
together to deliver Spansion SLC NAND products at the 4x, 3x, and 2x nodes to
the embedded market. The alliance, which will make its first Spansion SLC NAND
products available from the second quarter of 2012, will see the companies
enter into a patent cross-licensing agreement in order to facilitate commercial
manufacture.
Spansion’s NAND products supplement the alliance’s NOR flash memory range, aimed at serving embedded applications such as automotive, industrial and telecommunications industries. The existing range of products will be consolidated with a family of new NAND products over the coming months. Spansion will also continue the development of its charge-trapping NAND technology.
John Kispert, president and CEO of Spansion, commented, “As demand for NAND memory grows in embedded segments, we are well positioned as we continue to broaden our portfolio of Flash memory products to meet the stringent requirements of the embedded industry. Our cooperation with SK Hynix will enable us to expand our leadership in the embedded market with serial NOR, parallel NOR and now SLC NAND products.”