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Spansion and SK Hynix announce NAND partnership

03 April 2012 | By James Williams | News > Fab Management

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President and CEO of SK Hynix, Oh Chul Kwon and President and CEO of Spansion, John Kispert finalize the agreement on March 27thSpansion and SK Hynix have announced that they will work together to deliver Spansion SLC NAND products at the 4x, 3x, and 2x nodes to the embedded market. The alliance, which will make its first Spansion SLC NAND products available from the second quarter of 2012, will see the companies enter into a patent cross-licensing agreement in order to facilitate commercial manufacture.

Spansion’s NAND products supplement the alliance’s NOR flash memory range, aimed at serving embedded applications such as automotive, industrial and telecommunications industries. The existing range of products will be consolidated with a family of new NAND products over the coming months. Spansion will also continue the development of its charge-trapping NAND technology.

John Kispert, president and CEO of Spansion, commented, “As demand for NAND memory grows in embedded segments, we are well positioned as we continue to broaden our portfolio of Flash memory products to meet the stringent requirements of the embedded industry. Our cooperation with SK Hynix will enable us to expand our leadership in the embedded market with serial NOR, parallel NOR and now SLC NAND products.”

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