Online information source for semiconductor professionals

SOKUDO claims 300wph throughput for lithography track system

07 May 2009 | By Mark Osborne | News > Lithography

Popular articles

New Product: Applied Materials new EUV reticle etch system provides nanometer-level accuracy - 19 September 2011

Oberai discusses Magma’s move into solar PV yield management space - 29 August 2008

‚??Velocity‚?? the new buzzword in Intel‚??s PQS annual awards - 12 April 2012

Applied Materials adds Jim Rogers to Board of Directors - 29 April 2008

New Product: ASML Brion‚??s Tachyon MB-SRAF enables OPC-like compute times - 19 September 2011

Benchmark demonstrations at one of Toshiba’s 300mm fabs has verified that the newly launched ‘SOKUDO DUO’ coat/develop track platform has been able to process 300mm wafers at 300wph. The new productivity level is claimed to be a significant improvement over previous track systems with traditionally 200wph throughput levels.

The results were achieved in a stand-alone coat and develop track configuration in a production environment, the company said.

Related articles

New Product: SOKUDO‚??s new RF3T system pushes 200wph throughput - 03 December 2007

Applied Materials reduces role in Sokudo - 23 June 2009

New Product: SOKUDO DUO track system boost throughput to 250-300 wafers per hour - 25 June 2009

SOKUDO enters CEA-Leti IMAGINE Program to support multiple e-beam lithography - 16 September 2010

Nova‚??s 3090Next CD metrology system integrated into Sokudo‚??s RF3 track system - 27 February 2008

Reader comments

No comments yet!

Post your comment

Please enter the word you see in the image below: