Benchmark demonstrations at one of Toshiba’s 300mm fabs has verified that the newly launched ‘SOKUDO DUO’ coat/develop track platform has been able to process 300mm wafers at 300wph. The new productivity level is claimed to be a significant improvement over previous track systems with traditionally 200wph throughput levels.
The results were achieved in a stand-alone coat and develop track configuration in a production environment, the company said.