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Soitec Group announces Smart Stacking ready for manufacturing and technology transfer

27 March 2009 | By Jon Haines | News > Materials and Gases

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SoitecThe Soitec Group has announced that its circuit stacking technology, Smart Stacking(TM), is prepared for both manufacturing and technology transfer.  Soitec’s Tracit business unit’s low-temperature industrial process is able to reach waver-level circuit stacking onto a variety of starting materials.  To move a completed circuit onto another carrier without jeopardizing yield creates new opportunities for designers and Smart Stacking(TM) will soon permit many new photonics applications, RF circuits, and more complex 3D product architectures.

Soitec has also created this process to transfer thin layers of processed wafers onto a variety of materials, in order to reduce circuit fabrication from application needs.  It says several worldwide waver types from foundries and IDMs have been produced as prototypes in the company’s manufacturing line.

In a recent study about 3D ICs by Yole Development, an independent semiconductor market research and analysis firm, the demand for wafer-level transfer processing will increase by either 2010 or 2011, mainly because of image sensor applications.

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