Online information source for semiconductor professionals

SMIC yields on first HiPo 45nm wafer lots

30 June 2009 | By Mark Osborne | News > Wafer Processing

Popular articles

‚??Velocity‚?? the new buzzword in Intel‚??s PQS annual awards - 12 April 2012

Oberai discusses Magma’s move into solar PV yield management space - 29 August 2008

Applied Materials adds Jim Rogers to Board of Directors - 29 April 2008

TSMC honors suppliers at annual Supply Chain Management Forum - 03 December 2008

Sematech Litho Forum: Sematech mulling multi-beam mask writer effort - 12 May 2010

With the help of its process partner IBM, SMIC has said it has produced device yields from test lots for its germanium strained high-performance 45nm process offering. SMIC has previously qualified IBM’s 45nm bulk CMOS low-power process.

"I'm delighted with the progress of SMIC's 45nm project team, which continues to meet rigorous deadlines, and we appreciate the excellent support from IBM throughout this progress," said Dr. Robert Tsu, SMIC's 45nm project leader and Associate Vice President of Logic Technology. "Integrating the silicon germanium process and achieving a well-yielded test chip from the very first yield lot is a significant technical accomplishment, and these accomplishments allow SMIC to provide a highly manufacturable technology to our customers."

"It verifies the IBM- licensed technology, validates our strategic decision to invest in advanced logic technologies, and enhances SMIC's position as the advanced logic technology leader in China,” commented Dr. Richard Chang, SMIC's President and CEO This 45nm GP process is a proven, robust, high yielding, and high performance technology that we anticipate can not only deliver better performance, reliability, and cost to our valued customers, but also help SMIC become even more competitive in China and worldwide."

SMIC also updated revenue guidance for its second quarter, noting that a rebound in customer orders was stronger than anticipated. Initially, SMIC has said that revenue would increase Q-on-Q by 58% to 62%, however, this would now be in the range of 76% to 78%.

However, the foundry remained cautious on believing this was a recovery, noting that it could just be an inventory replenishment phase due to the severe production order cutbacks the foundries had seen since the fourth quarter of 2008.

Related articles

SMIC yields first 45nm 300mm wafers - 08 December 2008

SMIC to offer 40nm half node process at Shanghai 300mm fab - 15 October 2009

SMIC to spend US$1 billion on capital expenditure in 2011 - 18 February 2011

SMIC to start 32nm development in Jan-09 - 27 October 2008

SMIC in advanced negotiations with strategic investor - 25 March 2008

Reader comments

No comments yet!

Post your comment

Name:
Email:
Please enter the word you see in the image below: