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SMIC yields first 45nm 300mm wafers

08 December 2008 | By Mark Osborne | News > Wafer Processing

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Semiconductor Manufacturing International Corporation (SMIC) has said that its first wafer lots of 45nm bulk CMOS 300mm wafers have been fully processed and produced yields. The results are part of its process and development alliance with IBM. ‘Strong yields’ were achieved on its first full-flow lot under testing conditions set forth by IBM.

"Lead customers are pleased with the progress made by SMIC's 45nm project team and we appreciate the excellent technical support from IBM's Systems and Technology Group," said Dr. Robert Tsu, SMIC's 45nm project leader and Associate Vice President of Logic Technology. "This achievement has marked the first major milestone of the project and paves a way to provide an IBM-licensed technology and SMIC wafer foundry service to our customers."

According to SMIC, the 45nm milestone was completed ahead of schedule.  SMIC said that it has 45nm lead customers planning to start production in 2009.

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