Online information source for semiconductor professionals
SMIC yields first 45nm 300mm wafers
Popular articles
New Product: Applied Materials new EUV reticle etch system provides nanometer-level accuracy - 19 September 2011
Oberai discusses Magma’s move into solar PV yield management space - 29 August 2008
â??Velocityâ?? the new buzzword in Intelâ??s PQS annual awards - 12 April 2012
Applied Materials adds Jim Rogers to Board of Directors - 29 April 2008
TSMC honors suppliers at annual Supply Chain Management Forum - 03 December 2008
Semiconductor Manufacturing International Corporation (SMIC) has said that its first wafer lots of 45nm bulk CMOS 300mm wafers have been fully processed and produced yields. The results are part of its process and development alliance with IBM. ‘Strong yields’ were achieved on its first full-flow lot under testing conditions set forth by IBM.
"Lead customers are pleased with the progress made by SMIC's 45nm project team and we appreciate the excellent technical support from IBM's Systems and Technology Group," said Dr. Robert Tsu, SMIC's 45nm project leader and Associate Vice President of Logic Technology. "This achievement has marked the first major milestone of the project and paves a way to provide an IBM-licensed technology and SMIC wafer foundry service to our customers."
According to SMIC, the 45nm milestone was completed ahead of schedule. SMIC said that it has 45nm lead customers planning to start production in 2009.