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SMIC to start 32nm development in Jan-09

27 October 2008 | By Mark Osborne | News > Wafer Processing

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SMICHaving received the required U.S. Government export license, Semiconductor Manufacturing International Corporation (SMIC), will now start development of its 32nm process technology in January 2009. The license applies to all of SMIC’s fabs capable of this technology migration.

SMIC, has a development and manufacturing agreement with NOR flash manufacturer, Spansion. The foundry reiterated plans with Spansion to potentially start 32nm production at its Wuhan (Wuhan Xinxin International Corporation, 300mm fab in 2010.

"SMIC is happy to gain the 32nm approvals, which provide us the flexibility to deliver our technology advancement and fortify our leadership position in China,” commented Matthew Szymanski, Vice President for Corporate Relations and Manager of Export Compliance at SMIC. 

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