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SMIC to offer 40nm half node process at Shanghai 300mm fab

15 October 2009 | By Mark Osborne | News > Wafer Processing

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Following other foundries in offering half-node shrinks, SMIC will be using its 45nm CMOS process to offer a 40 and 55nm derivative. SMIC said it had already implemented it 45nm process at its 300mm fab in Shanghai and would be offering the new half-node technologies for applications such as multimedia products, graphics chips, chipsets, and mobile devices such as handsets integrated with 3G/4G.

"Our 45nm technology has been implemented at SMIC's 300mm facility in Shanghai ahead of schedule and we look forward to a similar result at these additional geometries," said SMIC's President and CEO, Dr. Richard Chang. "These new offerings provide our current and new customers a customized set of solutions to meet their diverse product design-in needs."

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