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SMIC in pilot production with 110nm CMOS image sensor technology

23 October 2008 | By Mark Osborne | News > Wafer Processing

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CMOS image sensorSemiconductor Manufacturing International Corporation (SMIC) has started pilot production of a 110nm CMOS image sensor (CIS) process technology that can be manufactured on 200mm and 300mm wafers, the company said. SMIC is offering the technology with both aluminum and copper backend metallization.

"Using optimized process conditions, we've successfully reduced dark noise, enabling performance in low light environments,” noted Paul Ouyang, SMIC Vice President of Marketing and Sales. “These features deliver to our customers a high performance product at a reasonable cost, which allows them to enhance their competitiveness and gain leading positions in an ever-growing CIS market."

SMIC believes the 110nm CIS technology is ideal for fully integrated and high density CIS applications.

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