Online information source for semiconductor professionals
SMIC in pilot production with 110nm CMOS image sensor technology
Popular articles
Voltaix names Peter Smith as CEO - 09 November 2011
Sematech Litho Forum: Sematech mulling multi-beam mask writer effort - 12 May 2010
TSMC hosts 2008 Green Forum on ‘green’ factories - 31 October 2008
Oberai discusses Magma’s move into solar PV yield management space - 29 August 2008
TSMC honors suppliers at annual Supply Chain Management Forum - 03 December 2008
Semiconductor Manufacturing International Corporation (SMIC) has started pilot production of a 110nm CMOS image sensor (CIS) process technology that can be manufactured on 200mm and 300mm wafers, the company said. SMIC is offering the technology with both aluminum and copper backend metallization.
"Using optimized process conditions, we've successfully reduced dark noise, enabling performance in low light environments,” noted Paul Ouyang, SMIC Vice President of Marketing and Sales. “These features deliver to our customers a high performance product at a reasonable cost, which allows them to enhance their competitiveness and gain leading positions in an ever-growing CIS market."
SMIC believes the 110nm CIS technology is ideal for fully integrated and high density CIS applications.