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Siltronic Samsung 300mm wafer fab plans ramp-up in 1H08

20 March 2008 | By Mark Osborne | News > Materials and Gases

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SiltronicSiltronic Samsung Wafer Pte. Ltd, the joint venture 300mm wafer production fab in Singapore, is expected to aggressively ramp production starting in the first half of 2008. The production of qualification wafers is already ongoing, according to Wacker AG, Siltronic’s parent company in disclosing full-year financial results. Construction started in August 2006.

“Our 300 mm joint venture with Samsung in Singapore has already begun to produce qualification wafers,” commented Wacker CEO, Peter-Alexander Wacker “The building, infrastructure and equipment were completed in record time. We expect the steep ramp-up to start in the first half of 2008. By the end of 2010, the joint venture should have a monthly capacity of 300,000 wafers.”

At its Burghausen plant, Siltronic doubled its monthly capacity for 300mm wafers to 135,000 in 2007, while it targets 200,000wspm at its facility in Freiberg. The Singapore facility is expected to be the main facility for wafer capacity expansion in the next few years.


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