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Siltronic and Samsung JV starts 300mm wafer production in new Singapore facility

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SiltronicSiltronic Samsung Wafer Pte. Ltd., the joint venture of Samsung Electronics Co. Ltd. and Siltronic AG, has begun 300mm wafer production at a newly commissioned US$1 billion facility in Singapore. The JV, which was completed in 18 months, is expected to produce 300,000 wafers and to generate over 800 jobs by 2010.

"The new 300 mm wafer fabrication plant is a result of the strong local support from Singapore´s Economic Development Board and the technology expertise of our partner, Siltronic,” said Oh-Hyun Kwon, President of Samsung Electronics´ Semiconductor Business division. “Together with Siltronic, Samsung anticipates Siltronic Samsung Wafer to play a significant role as a steady source of quality 300mm wafers at a time of rapid growth in the 300 mm wafer market segment."

Singapore’s Prime Minister Lee Hsien Loong, who attended the opening ceremony, said, “This plant is a key addition to our vibrant semiconductor ecosystem. It will extend Singapore´s semiconductor value chain, and bring us to the next level of wafering technology. The long-term prospect for the semiconductor industry remains bright and Singapore has positioned itself to take full advantage of this and remain a major manufacturing location in Asia for electronics and semiconductors."

By Síle Mc Mahon

 

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