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Siltronic and Samsung JV starts 300mm wafer production in new Singapore facility
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Siltronic Samsung Wafer Pte. Ltd., the joint venture of Samsung
Electronics Co. Ltd. and Siltronic AG, has begun 300mm wafer production
at a newly commissioned US$1 billion facility in Singapore. The JV,
which was completed in 18 months, is expected to produce 300,000 wafers
and to generate over 800 jobs by 2010.
"The new 300 mm wafer fabrication plant is a result of the strong
local support from Singapore´s Economic Development Board and the
technology expertise of our partner, Siltronic,” said Oh-Hyun Kwon,
President of Samsung Electronics´ Semiconductor Business division.
“Together with Siltronic, Samsung anticipates Siltronic Samsung Wafer
to play a significant role as a steady source of quality 300mm wafers
at a time of rapid growth in the 300 mm wafer market segment."
Singapore’s
Prime Minister Lee Hsien Loong, who attended the opening ceremony,
said, “This plant is a key addition to our vibrant semiconductor
ecosystem. It will extend Singapore´s semiconductor value chain, and
bring us to the next level of wafering technology. The long-term
prospect for the semiconductor industry remains bright and Singapore
has positioned itself to take full advantage of this and remain a major
manufacturing location in Asia for electronics and semiconductors."
By Síle Mc Mahon