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Semiconductor fab spending to double in 2010, says SEMI
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Spending of fabs is forecasted to rebound strongly in 2010, after declining 51% in 2009 to its lowest level in 10 years, according to the latest SEMI World Fab Forecast. The latest report also projects capital equipment spending to rocket by as much as 90% in 2010, compared to the low levels expected in 2009.
For the first time in several years, fab investments in the U.S. are expected to increase in 2009, due to Intel’s massive upgrades for 32nm production and helped by the news that Globalfoundries is to start construction of its first 300mm fab in New York State.
SEMI said that 9 fabs would start operations in 2009.
However, a total of 68 fabs would have closed over a three period, including some 300mm fabs due to bankruptcies. SEMI said that 19 fabs closed in 2008, while it expects 35 more fabs to close in 2009. A further 14 fabs are expected to close in 2010, indicating closures would slow going forward and new fab builds begin.
Worldwide installed capacity for 2009 is expected to decline by about 3%, mainly due to fab closures, however data from the World Fab Forecast indicates that installed capacity for 2010 could increase by about 6%.
