Online information source for semiconductor professionals
Semiconductor equipment billings continue decline in third quarter
Popular articles
New Product: Applied Materials new EUV reticle etch system provides nanometer-level accuracy - 19 September 2011
Oberai discusses Magma’s move into solar PV yield management space - 29 August 2008
â??Velocityâ?? the new buzzword in Intelâ??s PQS annual awards - 12 April 2012
Applied Materials adds Jim Rogers to Board of Directors - 29 April 2008
New Product: ASML Brionâ??s Tachyon MB-SRAF enables OPC-like compute times - 19 September 2011
Worldwide semiconductor manufacturing equipment billings fell 16% in the third quarter of 2008, compared to the previous quarter, reaching US$6.56 billion, according to the latest figures released by SEMI. Second quarter billings were $7.83 billion, 26 percent less than the first quarter of 2008.
Third quarter bookings reached US$5.60 billion, 37% less than the same quarter a year ago, and 20 percent less than the bookings figure for the second quarter of 2008. Bookings had reached $6.99 billion in the second quarter of 2008, 30 percent less than the same quarter a year ago.
A Year-on-Year comparison of billings figures continues to indicate a significant decline across all regions. The largest declines are in Taiwan, where foundries and memory manufacturers have aggressively cut capital expenditures. Billings in Taiwan are down negative 76% Y-on-Y.
Japan has also seen a rapid fall in billings in the third quarter of 2008, compared to the same quarter in 2007. The country had seen the smallest decline in billings but is now experiencing the second highest decline.
Although equipment billings in China are declining, the fall has slowed from -61% to just -22, and is comparable with the rate of decline in Korea.
