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Semiconductor equipment billings continue decline in third quarter

17 December 2008 | By Mark Osborne | News > Fab Management

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Worldwide semiconductor manufacturing equipment billings fell 16% in the third quarter of 2008Worldwide semiconductor manufacturing equipment billings fell 16% in the third quarter of 2008, compared to the previous quarter, reaching US$6.56 billion, according to the latest figures released by SEMI. Second quarter billings were $7.83 billion, 26 percent less than the first quarter of 2008.

Third quarter bookings reached US$5.60 billion, 37% less than the same quarter a year ago, and 20 percent less than the bookings figure for the second quarter of 2008. Bookings had reached $6.99 billion in the second quarter of 2008, 30 percent less than the same quarter a year ago.

A Year-on-Year comparison of billings figures continues to indicate a significant decline across all regions. The largest declines are in Taiwan, where foundries and memory manufacturers have aggressively cut capital expenditures. Billings in Taiwan are down negative 76% Y-on-Y.

Japan has also seen a rapid fall in billings in the third quarter of 2008, compared to the same quarter in 2007. The country had seen the smallest decline in billings but is now experiencing the second highest decline.

Although equipment billings in China are declining, the fall has slowed from -61% to just -22, and is comparable with the rate of decline in Korea.

The largest declines are in Taiwan, where foundries and memory manufacturers have aggressively cut capital expenditures.

Related articles

Worldwide semiconductor equipment billings tank - 10 September 2008

Taiwan semiconductor equipment sales growing fastest of all regions - 17 December 2009

Worldwide semiconductor equipment billings reach $10.56 billion in 1Q08 - 17 June 2008

Worldwide semiconductor equipment bookings down 29% in third quarter - 13 December 2011

Semiconductor equipment book-to-bill ratio in continued decline - 20 June 2008

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