Online information source for semiconductor professionals

Semiconductor book-to-bill ratio jumps to 0.85 in June

21 July 2008 | By Mark Osborne | News > Fab Management

Popular articles

New Product: Applied Materials new EUV reticle etch system provides nanometer-level accuracy - 19 September 2011

Oberai discusses Magma’s move into solar PV yield management space - 29 August 2008

‚??Velocity‚?? the new buzzword in Intel‚??s PQS annual awards - 12 April 2012

Applied Materials adds Jim Rogers to Board of Directors - 29 April 2008

TSMC honors suppliers at annual Supply Chain Management Forum - 03 December 2008

Book-To-BillThe June 2008 Book-to-Bill Report from SEMI posted a strong increase to 0.85, compared to that posted in May of only 0.79. This equated to $1.03 billion in orders in June 2008 (three-month average basis) for North America-based equipment suppliers. This is only the second rise in the book-to-bill ratio in 2008.

However, the bookings figure is approximately 36 percent less than the $1.61 billion in orders posted in June 2007.

"With a half year of data at hand, bookings for the North American equipment manufacturers are down 27 percent compared to the same period one year ago," said Daniel Tracy, Senior Director of Industry Research and Statistics at SEMI. "The industry awaits more clarity in the overall economic condition before increasing capital spending.”

The three-month average of worldwide billings in June 2008 was $1.21 billion, about eight percent less than the final May 2008 level of $1.31 billion, and about 31 percent less than the June 2007 billings level of $1.77 billion.

Book-to-Bill

Related articles

July book-to-bill ratio climbs to 0.83 - 25 August 2008

Semiconductor equipment bookings show improvement in June - 22 July 2009

Semiconductor equipment book-to-bill ratio in continued decline - 20 June 2008

Equipment bookings strengthen in November - 16 December 2011

Equipment orders reached US$863.3 million in December - 22 January 2010

Reader comments

No comments yet!

Post your comment

Name:
Email:
Please enter the word you see in the image below: