Online information source for semiconductor professionals

SEMICON: Globalfoundries collaborating with Intermolecular on deposition processes

13 July 2011 | By Mark Osborne | News > Wafer Processing

Popular articles

‚??Velocity‚?? the new buzzword in Intel‚??s PQS annual awards - 12 April 2012

Oberai discusses Magma’s move into solar PV yield management space - 29 August 2008

Applied Materials adds Jim Rogers to Board of Directors - 29 April 2008

TSMC honors suppliers at annual Supply Chain Management Forum - 03 December 2008

Sematech Litho Forum: Sematech mulling multi-beam mask writer effort - 12 May 2010

A multiyear Collaborative Development Program (CDP) and IP licensing agreement has been signed between Globalfoundries and Intermolecular to enable a fast-track method to develop process modules that will be integrated into the foundry’s fabs, worldwide. Most of the development work will be performed at Intermolecular’s HPC (High Productivity Combinatorial) R&D Center in San Jose, California.

“Our business model is built on collaboration, both in customer engagement and technology development,” said Gregg Bartlett, Senior Vice President of Technology and Research and Development at Globalfoundries. “This new collaboration with Intermolecular will bolster our R&D pipeline and be an important enhancement to our ability to rapidly address integration challenges and transfer IP-protected solutions into high-volume manufacturing. We’re especially pleased to work with Intermolecular to accelerate development not just for our most advanced technology nodes, but also for mature production lines, where we provide a wide variety of scalable plug-in modules to help our customers meet the widest possible range of market opportunities.”

Intermolecular said that researchers and engineers from both companies would work side by side, utilizing Intermolecular’s full suite of ‘Tempus’ wet-workflow development systems and Tempus AP-30 platforms, which can perform ALD, CVD and PVD deposition processes.

 “This is an extensive and diverse engagement, covering technology nodes from 45 nanometers down to 14 nanometers, spanning multiple process and device integration applications. The objective of our collaboration with Globalfoundries is to strengthen and accelerate their customer product offerings for markets that require leading-edge, high-performance, low-power, volume manufacturing capabilities,” added, David Lazovsky, Intermolecular president and CEO.

Related articles

STMicroelectronics to use Globalfoundries 40nm low power process - 29 July 2009

Tool Order: Globalfoundries Fab 7 receives 1000th VECTOR PECVD system from Novellus - 02 February 2010

Aixtron, Ovonyx team on AVD processes for phase-change memory - 20 January 2009

ATMI teams with Ovonyx on Phase Change Memory precursor materials - 24 March 2008

ASM International adds Taiwan foundry to Intel-included list of high-k ALD users - 28 April 2009

Reader comments

No comments yet!

Post your comment

Name:
Email:
Please enter the word you see in the image below: