Online information source for semiconductor professionals

SEMI: equipment bookings reach highest level in 2009

18 September 2009 | By Mark Osborne | News > Wafer Processing

Popular articles

Oberai discusses Magma’s move into solar PV yield management space - 29 August 2008

‚??Velocity‚?? the new buzzword in Intel‚??s PQS annual awards - 12 April 2012

Applied Materials adds Jim Rogers to Board of Directors - 29 April 2008

TSMC honors suppliers at annual Supply Chain Management Forum - 03 December 2008

Sematech Litho Forum: Sematech mulling multi-beam mask writer effort - 12 May 2010

Semiconductor equipment bookings for U.S. based suppliers reached their highest levels in for 2009 in August, according to the latest Book-to-Bill Report published by SEMI. Bookings of US$599.0 million were recorded in preliminary data. Bookings in the same month a year ago were US$886.8 million, representing a 31% decline. August book-to-bill ratio was 1.03, down from 1.06 in July, 2009.

“Equipment bookings have increased for five months in a row as market conditions recover from the very low levels reported earlier this year," said Stanley T. Myers, president and CEO of SEMI. “With semiconductor device sales and fab capacity utilization improving over recent months, we expect equipment spending to follow a similar trend during the recovery.”

The three-month average of worldwide billings in August 2009 was US$579.9 million. The billings figure is almost 8% greater than the final July 2009 level of US$538.0 million, and just over 45% less than the August 2008 billings level of US$1.06 billion.

Related articles

Semiconductor equipment bookings reach potential peak - 17 September 2010

Equipment bookings top US$790.5 in November - 21 December 2009

September semiconductor equipment bookings at US$1.62 billion - 22 October 2010

Semiconductor equipment bookings blossom - 24 August 2010

Semiconductor equipment bookings show improvement in June - 22 July 2009

Reader comments

No comments yet!

Post your comment

Name:
Email:
Please enter the word you see in the image below: